MIT Lab for Education and Application Prototypes (LEAP)
Teach integrated photonics manufacturing practice
Provide small medium enterprise (SME) / technician training and certification
Allow start-up and SME engagement in tool/process/application upgrades
Support the AIM MPW and TAP hubs.
Packaging + Testing Tools
• Microscope Stereo Packaging
• Wirebond Ball MEI
• Solder Station
• Freezer for Packaging
• Wirebond Wedge
The MIT LEAP facility includes equipment for students and industry to build prototypes in the realm of packaging of photonic components.
To use the MIT LEAP, please follow the directions provided by MIT.nano here
Machines by subcategory here
Create component prototypes by research collaborations with MA start-ups, SMEs and photonics industry partners: Innovative in integrated photonic components/tools/processes and applications
• Teach integrated photonics to develop the next-gen workforce through 3.155J / 6.152J (EECS/DMSE) Micro/Nano Processing Technology
MIT LEAP Program Offerings
MIT Lab Courses
To learn more about MIT’s LEAP, the LEAP network, or applying to become a Massachusetts LEAP site, please contact Anu Agarwal.