MIT Lab for Education and Application Prototypes (LEAP)

Objectives

  1. Teach integrated photonics manufacturing practice

  2. Provide small medium enterprise (SME) / technician training and certification

  3. Allow start-up and SME engagement in tool/process/application upgrades

  4. Support the AIM MPW and TAP hubs.

MIT.nano

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Packaging + Testing Tools

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Reflow Oven

Other Tools:

• Microscope Stereo Packaging    

• Wirebond Ball MEI    

• Diesaw-DAD3240    

• Solder Station   

• Freezer for Packaging    

• Wirebond Wedge   

 

The MIT LEAP facility includes equipment for students and industry to build prototypes in the realm of packaging of photonic components.

To use the MIT LEAP, please follow the directions provided by MIT.nano here

Machines by subcategory here

Education:

Workforce Development:

Create component prototypes by research collaborations with MA start-ups, SMEs and photonics industry partners: Innovative in integrated photonic components/tools/processes and applications

• Teach integrated photonics to develop the next-gen workforce through 3.155J / 6.152J (EECS/DMSE) Micro/Nano Processing Technology 

             

MIT LEAP Program Offerings

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Bootcamps

MIT Lab Courses

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To learn more about MIT’s LEAP, the LEAP network, or applying to become a Massachusetts LEAP site, please contact Anu Agarwal.