IKIM Mission
Teaching Packages
Teaching Packages
Teaching Packages
MIT Lab for Education and Application Prototypes (LEAP)
Objectives
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Teach integrated photonics manufacturing practice
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Provide small medium enterprise (SME) / technician training and certification
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Allow start-up and SME engagement in tool/process/application upgrades
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Support the AIM MPW and TAP hubs.
MIT.nano




Packaging + Testing Tools
Other Tools:
• Microscope Stereo Packaging
• Wirebond Ball MEI
• Diesaw-DAD3240
• Solder Station
• Freezer for Packaging
• Wirebond Wedge
The MIT LEAP facility includes equipment for students and industry to build prototypes in the realm of packaging of photonic components.
To use the MIT LEAP, please follow the directions provided by MIT.nano here
Machines by subcategory here
Education:
Workforce Development:
Create component prototypes by research collaborations with MA start-ups, SMEs and photonics industry partners: Innovative in integrated photonic components/tools/processes and applications
• Teach integrated photonics to develop the next-gen workforce through 3.155J / 6.152J (EECS/DMSE) Micro/Nano Processing Technology
MIT LEAP Program Offerings


Bootcamps
MIT Lab Courses

To learn more about MIT’s LEAP, the LEAP network, or applying to become a Massachusetts LEAP site, please contact Anu Agarwal.