IKIM Mission
Teaching Packages
Teaching Packages
Teaching Packages
MIT Lab for Education and Application Prototypes (LEAP)
Objectives
-
Teach integrated photonics manufacturing practice
-
Provide small medium enterprise (SME) / technician training and certification
-
Allow start-up and SME engagement in tool/process/application upgrades
-
Support the AIM MPW and TAP hubs.
MIT.nano




Packaging + Testing Tools
Other Tools:
​
• Microscope Stereo Packaging
​
• Wirebond Ball MEI
​
• Diesaw-DAD3240
​
• Solder Station
​
• Freezer for Packaging
​
• Wirebond Wedge
​
The MIT LEAP facility includes equipment for students and industry to build prototypes in the realm of packaging of photonic components.
​​
To use the MIT LEAP, please follow the directions provided by MIT.nano here
​
Machines by subcategory here
​
​
Education:
​
Workforce Development:
Create component prototypes by research collaborations with MA start-ups, SMEs and photonics industry partners: Innovative in integrated photonic components/tools/processes and applications
• Teach integrated photonics to develop the next-gen workforce through 3.155J / 6.152J (EECS/DMSE) Micro/Nano Processing Technology
​
MIT LEAP Program Offerings


Bootcamps
MIT Lab Courses

To learn more about MIT’s LEAP, the LEAP network, or applying to become a Massachusetts LEAP site, please contact Anu Agarwal.