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MIT Lab for Education and Application Prototypes (LEAP)

Objectives

  1. Teach integrated photonics manufacturing practice

  2. Provide small medium enterprise (SME) / technician training and certification

  3. Allow start-up and SME engagement in tool/process/application upgrades

  4. Support the AIM MPW and TAP hubs.

MIT.nano

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Packaging + Testing Tools

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Reflow Oven

Other Tools:

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• Microscope Stereo Packaging    

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• Wirebond Ball MEI    

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• Diesaw-DAD3240    

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• Solder Station   

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• Freezer for Packaging    

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• Wirebond Wedge   

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The MIT LEAP facility includes equipment for students and industry to build prototypes in the realm of packaging of photonic components.

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To use the MIT LEAP, please follow the directions provided by MIT.nano here

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Machines by subcategory here

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Education:

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Workforce Development:

Create component prototypes by research collaborations with MA start-ups, SMEs and photonics industry partners: Innovative in integrated photonic components/tools/processes and applications

• Teach integrated photonics to develop the next-gen workforce through 3.155J / 6.152J (EECS/DMSE) Micro/Nano Processing Technology 

             

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MIT LEAP Program Offerings

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Bootcamps

MIT Lab Courses

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To learn more about MIT’s LEAP, the LEAP network, or applying to become a Massachusetts LEAP site, please contact Anu Agarwal.

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