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FUTUR-IC Technology


  1. Electronic-Photonic Package (EPP) integration

    • System demonstrators for advanced packaging solutions

  2. PFAS detection, removal and replacement

  3. iNEMI's multicompany project for package adhesive materials

The Chip era has ended.


The System-in-Package era in full implementation, with Electronic-Photonic functionality.

Electronic-Photonic Integration is the ‘transistor of the 21st Century’


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